ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,139, issued on Oct. 14, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland). "DAC with configurable output stage" w... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,098,296, issued on Oct. 14. "Stacking building blocks base" was invented by Qiongzhou Xie (Shantou, China). The patent was filed on July 3, 20... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,098,515, issued on Oct. 14, was assigned to VOLKSWAGEN AG (Wolfsburg, Germany). "Vehicle taillight" was invented by Urs Rahmel (Wolfsburg, Germ... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,283, issued on Oct. 14, was assigned to Hitachi Construction Machinery Co. Ltd. (Tokyo). "Dump truck" was invented by Masanori Ichinose (To... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,739, issued on Oct. 14, was assigned to Fractal Analytics Private Ltd. (Mumbai, India). "Systems and methods for responsible AI" was invent... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,493, issued on Oct. 14, was assigned to LINEBIRD INC. (Richmond, Va.). "Payload support frame for unmanned aerial system" was invented by M... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,992, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Communication method and apparatus in wirele... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,596, issued on Oct. 14, was assigned to Tencent America LLC (Palo Alto, Calif.). "Block vector refinement method for intra block copy" was ... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,581, issued on Oct. 14, was assigned to Comcast Cable Communications LLC (Philadelphia). "Methods, systems, and apparatuses for improved da... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,620, issued on Oct. 14, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming SiP module absent ... Read More