US Patent Issued to INTERNATIONAL INSTITUTE OF INFORMATION TECHNOLOGY, HYDERABAD on Nov. 25 for "System and method for proven secret key agreement between initiating unit and responding unit" (Indian Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,398, issued on Nov. 25, was assigned to INTERNATIONAL INSTITUTE OF INFORMATION TECHNOLOGY, HYDERABAD (Hyderabad, India). "System and method... Read More

US Patent Issued to SHIMADZU on Nov. 25 for "Raman spectroscopy analysis method and microscopic Raman spectroscopy device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,881, issued on Nov. 25, was assigned to SHIMADZU Corp. (Kyoto, Japan). "Raman spectroscopy analysis method and microscopic Raman spectrosco... Read More

US Patent Issued to NEC on Nov. 25 for "Superclass-conditional gaussian mixture model for personalized prediction on dialysis events" (New Jersey Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,882, issued on Nov. 25, was assigned to NEC Corp. (Tokyo). "Superclass-conditional gaussian mixture model for personalized prediction on di... Read More

US Patent Issued to WORLD SCAN PROJECT on Nov. 25 for "Unmanned flight device, management device and flight management method" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,744, issued on Nov. 25, was assigned to WORLD SCAN PROJECT CORP. (Tokyo). "Unmanned flight device, management device and flight management ... Read More

US Patent Issued to Oracle International on Nov. 25 for "Provisional response handling in SIP calls" (Canadian, Indian Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,609, issued on Nov. 25, was assigned to Oracle International Corp. (Redwood City, Calif.). "Provisional response handling in SIP calls" was... Read More

US Patent Issued to Huawei Technologies on Nov. 25 for "Package structure and package system" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,724, issued on Nov. 25, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Package structure and package system" was invented... Read More

US Patent Issued to SHIMADZU on Nov. 25 for "Analyzer and display method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,152, issued on Nov. 25, was assigned to SHIMADZU Corp. (Kyoto, Japan). "Analyzer and display method" was invented by Kota Ogino (Kyoto, Jap... Read More

US Patent Issued to Silicon Laboratories on Nov. 25 for "Reducing output harmonics and ground bounce in a transmitter" (American, Indian Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,212, issued on Nov. 25, was assigned to Silicon Laboratories Inc. (Austin, Texas). "Reducing output harmonics and ground bounce in a transm... Read More

US Patent Issued to LOUISIANA-PACIFIC on Nov. 25 for "Structural panel with exterior insulating foam layer" (Tennessee Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,307, issued on Nov. 25, was assigned to LOUISIANA-PACIFIC CORP. (Nashville, Tenn.). "Structural panel with exterior insulating foam layer" ... Read More

US Patent Issued to NGK INSULATORS on Nov. 25 for "AlN single crystal substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,226, issued on Nov. 25, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "AlN single crystal substrate" was invented by Hirohisa Ogawa ... Read More

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