Exclusive

Publication

Byline

INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "THERMOPLASTIC RELEASE FILM FOR SEMICONDUCTOR SEALING PROCESS"

GENEVA, May 27 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央&#... Read More


INTERNATIONAL PATENT: SEMITEC CORPORATION, SEMITEC株式会社 FILES APPLICATION FOR "TEMPERATURE SENSOR AND DEVICE EQUIPPED WITH TEMPERATURE SENSOR"

GENEVA, May 27 -- SEMITEC CORPORATION (7-7, Kinshi 1-Chome, Sumida-ku Tokyo1308512), SEMITEC株式会社 (東京都&... Read More


INTERNATIONAL PATENT: JX ADVANCED METALS CORPORATION, JX金属株式会社 FILES APPLICATION FOR "SPUTTERING TARGET ASSEMBLY AND FILM"

GENEVA, May 27 -- JX ADVANCED METALS CORPORATION (10-4, Toranomon 2-chome, Minato-ku, Tokyo1058417), JX金属株式会社 (東京都港&... Read More


INTERNATIONAL PATENT: NEC CORPORATION, 日本電気株式会社 FILES APPLICATION FOR "WORK EVALUATION DEVICE, WORK EVALUATION METHOD AND PROGRAM"

GENEVA, May 27 -- NEC CORPORATION (7-1, Shiba 5-chome, Minato-ku, Tokyo1088001), 日本電気株式会社 (東京都港区芝&#201... Read More


INTERNATIONAL PATENT: SHIN-ETSU CHEMICAL CO., LTD., 信越化学工業株式会社, SHINSHU UNIVERSITY, 国立大学法人信州大学 FILES APPLICATION FOR "GEL COMPOSITION, MEMBER, ELECTRONIC ELEMENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING GEL COMPOSITION"

GENEVA, May 27 -- SHIN-ETSU CHEMICAL CO., LTD. (4-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1000005), 信越化学工業株式会社 (東京&#... Read More


INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社, THE UNIVERSITY OF TOKYO, 国立大学法人東京大学 FILES APPLICATION FOR "MICRONEEDLE STRUCTURE AND METHOD FOR PRODUCING SAME"

GENEVA, May 27 -- LINTEC CORPORATION (23-23, Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋&#213... Read More


INTERNATIONAL PATENT: KABUSHIKI KAISHA TOSHIBA, 株式会社東芝, TOSHIBA INFRASTRUCTURE SYSTEMS & SOLUTIONS CORPORATION, 東芝インフラシステムズ株式会社 FILES APPLICATION FOR "MICROPARTICLE MEASURING SYSTEM AND MICROPARTICLE MEASURING METHOD"

GENEVA, May 27 -- KABUSHIKI KAISHA TOSHIBA (1-1, Shibaura 1-chome, Minato-ku, Tokyo1050023), 株式会社東芝 (東京都港区芝浦&... Read More


INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR PRODUCING ACID FLUORIDE-FILLED CONTAINER"

GENEVA, May 27 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#282... Read More


INTERNATIONAL PATENT: MITSUBISHI MATERIALS CORPORATION, 三菱マテリアル株式会社, TOHOKU UNIVERSITY, 国立大学法人東北大学 FILES APPLICATION FOR "COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL APPARATUS, COMPONENT FOR FLEXIBLE DEVICE, COMPONENT FOR HEAT DISSIPATION AND METAL SEALING MATERIAL"

GENEVA, May 27 -- MITSUBISHI MATERIALS CORPORATION (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008117), 三菱マテリアル株式会社 (&#2648... Read More


INTERNATIONAL PATENT: ASAHIMUSEN CO., LTD., 株式会社旭無線, KONDO HIROSHI, 近藤 弘 FILES APPLICATION FOR "INSOLE FOR FOOTWEAR, GENERAL-PURPOSE INSOLE AND FOOTWEAR USING GENERAL-PURPOSE INSOLE"

GENEVA, May 27 -- ASAHIMUSEN CO., LTD. (3-7, Idogayakamimachi, Minami-ku, Yokohama-shi, Kanagawa2320051), 株式会社旭無線 (神奈川県&#27... Read More