ALEXANDRIA, Va., June 25 -- United States Patent no. D1,081,008, issued on June 24, was assigned to Shenzhen Baojiali Sport Equipment Co. Ltd (Shenzhen, China). "Helmet" was invented by Jianxin Xu (S... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,529, issued on June 24, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, process vessel, method of manufact... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,061, issued on June 24, was assigned to PROTECHNA S.A. (Fribourg, Switzerland). "Transport and storage container for liquids" was invented ... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,337,009, issued on June 24, was assigned to THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK (New York). "Nucleotide derivatives and... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. D1,080,776, issued on June 24. "Dumbbell trap bar" was invented by Sanxing Yu (HengYang, China). The patent was filed on Jan. 16, 2025, under App... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,651, issued on June 24, was assigned to Aristocrat Technologies Australia Pty Ltd. (North Ryde, Australia). "Controller device for variably... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,592, issued on June 24. "Animal feces collection assembly" was invented by Matt Smith (Cumming, Ga.) and Jake Smith (Cumming, Ga.). Accord... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. D1,080,803, issued on June 24, was assigned to Olivier NV (Rumbeke, Belgium). "Cistern" was invented by Gerdi Vankeirsbilck (Rumbeke, Belgium). T... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,198, issued on June 24, was assigned to Apple Inc. (Cupertino, Calif.). "Parallel beam management in new band combinations" was invented by... Read More
ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,121, issued on June 24, was assigned to Intel Corp. (Santa Clara, Calif.). "Through-substrate underfill formation for an integrated circuit... Read More