ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,124, issued on Nov. 4, was assigned to Life Technologies Corp. (Carlsbad, Calif.). "Fluorescent particles" was invented by Adam York (Eugene... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,298, issued on Nov. 4, was assigned to Coupang Corp. (Seoul, South Korea). "Computer-implemented systems and methods for real-time risk-info... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,694, issued on Nov. 4, was assigned to FUJIFILM Corp. (Tokyo). "Electromagnetic shielding member" was invented by Takahiko Ichiki (Kanagawa,... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,667, issued on Nov. 4. "System for transporting airplanes on an airport apron" was invented by Slawomir Malicki (Gora Kalwaria, Poland). Ac... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,776, issued on Nov. 4, was assigned to QUALCOMM Inc. (San Diego). "Aperiodic zero power channel state information reference signal enhanceme... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,287, issued on Nov. 4, was assigned to CANON K.K. (Tokyo). "Image pickup apparatus" was invented by Yohei Yamada (Tokyo). According to the ... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,106, issued on Nov. 4, was assigned to KYOCERA Corp. (Kyoto, Japan). "Three-dimensional display device, image display system, and movable bo... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,436, issued on Nov. 4, was assigned to SEIKO EPSON Corp. (Tokyo). "Projector" was invented by Hidefumi Sakata (Azumino, Japan). According t... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,567, issued on Nov. 4, was assigned to Lockheed Martin Corp. (Bethesda, Md.). "Random access for broadband 4G and 5G over satellite" was inv... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,107, issued on Nov. 4, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor package" was invented by Hideo Komo (Tokyo). Accor... Read More