ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,292, issued on Sept. 23, was assigned to Arm Ltd. (Cambridge, Great Britain). "Masking techniques for memory applications" was invented by... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,419,807, issued on Sept. 23, was assigned to Fresenius Kabi Deutschland GmbH (Bad Homburg, Germany). "Medical packaging in the form of an infu... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,117, issued on Sept. 23, was assigned to INNOPEAK TECHNOLOGY INC. (Palo Alto, Calif.). "Apparatus and method of a mobile terminating user ... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,293, issued on Sept. 23, was assigned to Wolfspeed Inc. (Durham, N.C.). "Group III-nitride transistors with back barrier structures and bu... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,419,626, issued on Sept. 23, was assigned to NuVasive Inc. (San Diego). "Bone distraction devices and methods of using same" was invented by E... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,425,906, issued on Sept. 23, was assigned to LG Electronics Inc. (Seoul, South Korea). "Method and apparatus for measurement failure reporting... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,003, issued on Sept. 23. "Endovascular device for dysfunctional fistulas" was invented by Antonio Salsano (Chieti, Italy) and Giancarlo Sa... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,585, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Apparatus for bonding chip band method for... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,436, issued on Sept. 23, was assigned to Delta Electronics Inc. (Taoyuan, Taiwan). "Electric gripper" was invented by Chih-Ming Hsu (Taoyu... Read More
ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,495, issued on Sept. 23, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Chip separation supported by back side trench and... Read More