ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,975, issued on July 22, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Sputtering apparatus and CVD mask coating metho... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,365, issued on July 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor devices with backside... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. D1,085,027, issued on July 22, was assigned to ABB Schweiz AG (Baden, Switzerland). "Human machine interface for protection relay" was invented by... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,013, issued on July 22, was assigned to Therm-O-Disc Inc. (Westerville, Ohio). "Thermal cut-off device for high power applications" was inv... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,364, issued on July 22, was assigned to Diodes Inc. (Plano, Texas). "Power MOSFET with gate-source ESD diode structure" was invented by Wan... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,366,784, issued on July 22, was assigned to View Operating Corp. (San Jose, Calif.). "Electrochromic cathode materials" was invented by Robert ... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,987, issued on July 22, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of processing substrate, method of manufacturing semiconduc... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,069, issued on July 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer device including housing provided with fan" was in... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. D1,085,599, issued on July 22, was assigned to Shenzhen Huahanxing Technology Co. Ltd. (Shenzhen, China). "Washer and dryer stacking kit with shel... Read More
ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,566, issued on July 22, was assigned to TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) (Stockholm). "Selection of TDD patterns for DL and UL commun... Read More