ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,854, issued on Sept. 2, was assigned to Resonac Corp. (Tokyo). "Dry etching method, production method for semiconductor element, and cleani... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,405,483, issued on Sept. 2, was assigned to IonQ Inc. (College Park, Md.). "Piezo-based beam stabilization for cryogenic environments" was inve... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,405,807, issued on Sept. 2, was assigned to Dell Products LP (Round Rock, Texas). "System and method for boot and shutdown synchronization of s... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,403,791, issued on Sept. 2, was assigned to Rivian IP Holdings LLC. "Wireless network connections for electric vehicle chargers" was invented b... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,163, issued on Sept. 2, was assigned to Motorola Mobility LLC (Chicago). "Identifying a resource for transmitting a first uplink channel" w... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,404,501, issued on Sept. 2, was assigned to EVONIK OPERATIONS GMBH (Essen, Germany). "Method of cell lysis" was invented by Steliyana Dimitrova... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. D1,091,382, issued on Sept. 2, was assigned to Zhejiang Sanyou Vehicle Technology Co. Ltd. (Taizhou, China). "Electric motorcycle" was invented by... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,402,888, issued on Sept. 2, was assigned to University of Maryland, Baltimore (Baltimore). "Trans-esophageal aortic flow rate control" was inve... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,405,883, issued on Sept. 2, was assigned to Dell Products LP (Round Rock, Texas). "Managing decref processing from tablets containing sorted bu... Read More
ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,914, issued on Sept. 2, was assigned to Intel Corp. (Santa Clara, Calif.). "Ultra-thin, hyper-density semiconductor packages" was invented ... Read More