US Patent Issued to FINNCURE on May 27 for "Methods of fabricating carriers for targeted delivery to a host" (Finnish Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,061, issued on May 27, was assigned to FINNCURE OY (Espoo, Finland). "Methods of fabricating carriers for targeted delivery to a host" was ... Read More

US Patent Issued to Rapid7 on May 27 for "Data value classifier" (Ohio, Texas Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,316,648, issued on May 27, was assigned to Rapid7 Inc. (Boston). "Data value classifier" was invented by Matthew Kienow (Dayton, Ohio) and Bren... Read More

US Patent Issued to Garmin International on May 27 for "Topside buoy system" (North Carolina, Kansas, California Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,053, issued on May 27, was assigned to Garmin International Inc. (Olathe, Kan.). "Topside buoy system" was invented by Michael R. Kleinigge... Read More

US Patent Issued on May 27 for "High-throughput multiplexed sensitivity and resistance assay" (California Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,631, issued on May 27. "High-throughput multiplexed sensitivity and resistance assay" was invented by Christian Apfel (Redwood City, Calif.... Read More

US Patent Issued to Xerox on May 27 for "System and method for operating an inkjet printer to attenuate ink drying in the inkjets during printing operations" (New York Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,683, issued on May 27, was assigned to Xerox Corp. (Norwalk, Conn.). "System and method for operating an inkjet printer to attenuate ink dr... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 27 for "Interconnection structure of a semiconductor chip having pads of different widths and semiconductor package including the interconnection structure" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,818, issued on May 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Interconnection structure of a semiconductor ... Read More

US Patent Issued to LARGAN PRECISION on May 27 for "Imaging lens assembly module, camera module and electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,313,898, issued on May 27, was assigned to LARGAN PRECISION Co. LTD. (Taichung, Taiwan). "Imaging lens assembly module, camera module and elect... Read More

US Patent Issued to entigenlogic on May 27 for "Interpreting meaning of content" (California, Illinois, Georgia, South Carolina Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,314,662, issued on May 27, was assigned to entigenlogic LLC (Schaumburg, Ill.). "Interpreting meaning of content" was invented by Frank John Wi... Read More

US Patent Issued to EWALD DORKEN on May 27 for "Construction foil and system with at least one construction foil" (German Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,811, issued on May 27, was assigned to EWALD DORKEN AG (Herdecke, Germany). "Construction foil and system with at least one construction fo... Read More

US Patent Issued to Shenzhen sukule technology on May 27 for "Hands free crutch" (Chinese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. D1,076,403, issued on May 27, was assigned to Shenzhen sukule technology Co. ltd. (Shenzhen, China). "Hands free crutch" was invented by Ting Wang... Read More

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