ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,169, issued on Nov. 25, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan). "Synchronous motor driving device and synchronous motor d... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,739, issued on Nov. 25, was assigned to Siemens AG (Munich). "Arrangement for a semiconductor arrangement comprising at least one passive c... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,781, issued on Nov. 25, was assigned to GM GLOBAL TECHNOLOGY OPERATIONS LLC (Detroit). "Crowd-sourcing lane line maps for a vehicle" was in... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,318, issued on Nov. 25, was assigned to Nokia Solutions and Networks Oy (Espoo, Finland). "Timing synchronization for non-terrestrial netwo... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,908, issued on Nov. 25, was assigned to Jiangsu (Jiangsu, China). "Battery and manufacturing method of battery" was invented by Luoyi Xiang... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,633, issued on Nov. 25, was assigned to Sara Rose International INC. (New Taipei, Taiwan). "Beverage container lid" was invented by James L... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,314, issued on Nov. 25, was assigned to Aspen Surgical Products Inc. (Caledonia, Mich.). "Method and apparatus for protecting electronic eq... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,130, issued on Nov. 25, was assigned to UPI SEMICONDUCTOR CORP. (Zhubei, Taiwan). "Controller of power conversion circuit and operating met... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,911, issued on Nov. 25, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing). "Phase shifter having first and second subst... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,718, issued on Nov. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Thermally enhanced embedded die package" was invented by Woochan ... Read More