ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,290, issued on Nov. 11, was assigned to MINEBEA ACCESSSOLUTIONS ITALIA S.P.A. (Pianezza, Italy). "Vehicle door handle assembly" was invente... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,400, issued on Nov. 11, was assigned to Rolls-Royce Solutions GmbH (Friedrichshafen, Germany). "Manifold, a turbomachine including such a m... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. D1,101,875, issued on Nov. 11. "Toy" was invented by Shaoxian Cai (Shantou, China). The patent was filed on Nov. 19, 2020, under Application No. ... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,332, issued on Nov. 11, was assigned to GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP. LTD. (Guangdong, China). "Discontinuous reception re... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,465,984, issued on Nov. 11, was assigned to Precision Guide Machinery and Repair Ltd. (Prince George, Canada). "Lubricant flow control manageme... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,465,200, issued on Nov. 11, was assigned to Research Development International Corp. (Pasadena, Calif.). "Steerable micro-endoscope having an e... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,535, issued on Nov. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Multilevel non-volatile memory ... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,998, issued on Nov. 11, was assigned to PELTBEAM INC. (Sherman Oaks, Calif.). "System and method for telemetry information-based network ro... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,465,971, issued on Nov. 11, was assigned to Triad National Security LLC (Los Alamos, Texas). "Equipment for simultaneous or near-simultaneous f... Read More
ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,470,185, issued on Nov. 11, was assigned to Wolfspeed Inc. (Durham, N.C.). "Semiconductor device packages with exposed heat dissipating surface... Read More