US Patent Issued to Beijing BOE Technology Development, BOE Technology Group on July 1 for "Antenna and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,946, issued on July 1, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing). "A... Read More

US Patent Issued to Cisco Technology on July 1 for "Automatically detecting authorized remote administration sessions in a network monitoring system" (American, Czech Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,386, issued on July 1, was assigned to Cisco Technology Inc. (San Jose, Calif.). "Automatically detecting authorized remote administration s... Read More

US Patent Issued to Oshkosh on July 1 for "Sandwiched power take-off (PTO) for a vehicle" (Wisconsin Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,576, issued on July 1, was assigned to Oshkosh Corp. (Oshkosh, Wis.). "Sandwiched power take-off (PTO) for a vehicle" was invented by Eric L... Read More

US Patent Issued to Canon on July 1 for "Image processing apparatus capable of efficiently converting image file, control method therefor, and storage medium" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,293, issued on July 1, was assigned to Canon K.K. (Tokyo). "Image processing apparatus capable of efficiently converting image file, control... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Recessed blocking structure for BLC pixels" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,476, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Recessed blocking structure for BLC p... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 1 for "Debonding structures for wafer bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,717, issued on July 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Debonding structures for wafer bondin... Read More

US Patent Issued to CANON on July 1 for "Lens apparatus and image pickup apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,869, issued on July 1, was assigned to CANON K.K. (Tokyo). "Lens apparatus and image pickup apparatus" was invented by Hideki Sakai (Sakura,... Read More

US Patent Issued to Boston Scientific Neuromodulation on July 1 for "Connectors for an electrical stimulation system and methods of making and using" (California Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,343,547, issued on July 1, was assigned to Boston Scientific Neuromodulation Corp. (Valencia, Calif.). "Connectors for an electrical stimulation... Read More

US Patent Issued to AI21 LABS on July 1 for "Controllable reading guides and natural language generation" (Israeli Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,668, issued on July 1, was assigned to AI21 LABS (Tel Aviv, Israel). "Controllable reading guides and natural language generation" was inven... Read More

US Patent Issued to InVue Security Products on July 1 for "Tethered security system with wireless communication" (North Carolina, South Carolina Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,285, issued on July 1, was assigned to InVue Security Products Inc. (Charlotte, N.C.). "Tethered security system with wireless communication... Read More

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