US Patent Issued to Mitek Systems on Jan. 13 for "User identification document verifications" (California Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,635, issued on Jan. 13, was assigned to Mitek Systems Inc. (San Diego). "User identification document verifications" was invented by Ashok ... Read More

US Patent Issued to Eliantte Group on Jan. 13 for "Infinity necklace" (New York Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. D1,109,002, issued on Jan. 13, was assigned to Eliantte Group Inc. (New York). "Infinity necklace" was invented by Elliot Buryev (New York). The ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Jan. 13 for "Content visualizing method and device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,487, issued on Jan. 13, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Content visualizing method and device" was i... Read More

US Patent Issued to Intrinsic Innovation on Jan. 13 for "Streaming input buffer for real-time robotic control" (German Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,886, issued on Jan. 13, was assigned to Intrinsic Innovation LLC (Mountain View, Calif.). "Streaming input buffer for real-time robotic con... Read More

US Patent Issued to CHANGXIN MEMORY TECHNOLOGIES on Jan. 13 for "Method for forming semiconductor structure, laminate structure, and method for forming laminate structure" (Chinese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,010, issued on Jan. 13, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Method for forming semiconductor structure, lami... Read More

US Patent Issued to Wacker Neuson Produktion on Jan. 13 for "Soil compacting device having an electric drive" (German Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,996, issued on Jan. 13, was assigned to Wacker Neuson Produktion Gmbh & Co. KG (Reichertshofen, Germany). "Soil compacting device having an... Read More

US Patent Issued to ORION on Jan. 13 for "Packaging" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. D1,108,977, issued on Jan. 13, was assigned to ORION Corp. (Seoul, South Korea). "Packaging" was invented by Hyun A Lee (Seongnam-si, South Korea)... Read More

US Patent Issued to Texas Instruments on Jan. 13 for "Loop delay compensation in a delta-sigma modulator" (Indian Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,989, issued on Jan. 13, was assigned to Texas Instruments Inc. (Dallas). "Loop delay compensation in a delta-sigma modulator" was invented ... Read More

US Patent Issued to Tokyo Electron on Jan. 13 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,926, issued on Jan. 13, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More

US Patent Issued to UNITED MICROELECTRONICS on Jan. 13 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,040, issued on Jan. 13, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan). "Semiconductor device and method for fabricating ... Read More

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