US Patent Issued to Tokyo Electron on Jan. 13 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,926, issued on Jan. 13, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Yusuke Kikuchi (Yamanashi, Japan) and Masato Shinada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a substrate processing method for a substrate processing apparatus. The substrate processing apparatus comprises: a processing chamber; a placing stand provided inside the processing chamber, configured to place a substrate on a placing surface, and having a gas path; a freezing device having a contact surface to be in contact with or separated from a surface to be contacted of t...