US Patent Issued to PT SPE SUBCO on April 29 for "Solvent-free formulations and nanocomposites" (Maryland Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,549, issued on April 29, was assigned to PT SPE SUBCO LLC (Baltimore). "Solvent-free formulations and nanocomposites" was invented by Peter ... Read More

US Patent Issued to CISCO TECHNOLOGY on April 29 for "Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,831, issued on April 29, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Providing one or more carbon layers to a copper conducti... Read More

US Patent Issued to CISCO TECHNOLOGY on April 29 for "Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,831, issued on April 29, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Providing one or more carbon layers to a copper conducti... Read More

US Patent Issued to SAMSUNG DISPLAY on April 29 for "Display apparatus and method of manufacturing display apparatus" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,966, issued on April 29, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display apparatus and method of manufacturing... Read More

US Patent Issued to SAMSUNG DISPLAY on April 29 for "Display apparatus and method of manufacturing display apparatus" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,966, issued on April 29, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display apparatus and method of manufacturing... Read More

US Patent Issued to LINTEC on April 29 for "Adhesion device and adhesion method" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,260, issued on April 29, was assigned to LINTEC Corp. (Tokyo). "Adhesion device and adhesion method" was invented by Kazuhiro Azuhata (Tokyo... Read More

US Patent Issued to LINTEC on April 29 for "Adhesion device and adhesion method" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,260, issued on April 29, was assigned to LINTEC Corp. (Tokyo). "Adhesion device and adhesion method" was invented by Kazuhiro Azuhata (Tokyo... Read More

US Patent Issued to ResMed on April 29 for "Humidification tub bottom" (Australian Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. D1,073,026, issued on April 29, was assigned to ResMed Pty Ltd (Bella Vista, Australia). "Humidification tub bottom" was invented by Hargopal Verma... Read More

US Patent Issued to ResMed on April 29 for "Humidification tub bottom" (Australian Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. D1,073,026, issued on April 29, was assigned to ResMed Pty Ltd (Bella Vista, Australia). "Humidification tub bottom" was invented by Hargopal Verma... Read More

US Patent Issued to NXP USA on April 29 for "Semiconductor device with open cavity and method therefor" (Arizona Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,766, issued on April 29, was assigned to NXP USA Inc. (Austin, Texas). "Semiconductor device with open cavity and method therefor" was inven... Read More

• ««
• «
• 124314
• 124315
• 124316
• 124317
• 124318
• 124319
• 124320
• 124321
• 124322
• 124323
• »
• »»