US Patent Issued to National University Corporation Hokkaido University, Mochida Pharmaceutical on Nov. 25 for "Method for suppressing intervertebral disc pain" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,478,637, issued on Nov. 25, was assigned to National University Corporation Hokkaido University (Hokkaido, Japan) and Mochida Pharmaceutical Co.... Read More

US Patent Issued to YONGKANG ZHUOYI LEISURE PRODUCTS on Nov. 25 for "Cart" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,484, issued on Nov. 25, was assigned to YONGKANG ZHUOYI LEISURE PRODUCTS Co. LTD.. "Cart" was invented by Zhaocheng Lv (Jinhua, China). Ac... Read More

US Patent Issued to QUALCOMM on Nov. 25 for "Configuration for phase tracking reference signal ports to enable uplink transmission with multiple codewords" (Chinese, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,304, issued on Nov. 25, was assigned to QUALCOMM Inc. (San Diego). "Configuration for phase tracking reference signal ports to enable uplin... Read More

US Patent Issued to SENSYLINK MICROELECTRONICS on Nov. 25 for "Drift-free humidity sensor and calibration method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,902, issued on Nov. 25, was assigned to SENSYLINK MICROELECTRONICS INC. (Shanghai). "Drift-free humidity sensor and calibration method ther... Read More

US Patent Issued to POSCO on Nov. 25 for "Ultra-thick structural steel having excellent brittle crack initiation resistance, and manufacturing method therefor" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,171, issued on Nov. 25, was assigned to POSCO Co. LTD (Pohang-si, South Korea). "Ultra-thick structural steel having excellent brittle crac... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Semiconductor package including heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,721, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including heat dissipa... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 25 for "Method and apparatus for generating image file" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,817, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method and apparatus for generating image fi... Read More

US Patent Issued to FUJI ELECTRIC on Nov. 25 for "Semiconductor device manufacturing method and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,727, issued on Nov. 25, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device manufacturing method and semiconduc... Read More

US Patent Issued to KLA on Nov. 25 for "Detecting defects on specimens" (Chinese, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,091, issued on Nov. 25, was assigned to KLA Corp. (Milpitas, Calif.). "Detecting defects on specimens" was invented by Li Yu (Shanghai), We... Read More

US Patent Issued to Skydio on Nov. 25 for "Motion-based calibration of an aerial device" (California Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,074, issued on Nov. 25, was assigned to Skydio Inc. (San Mateo, Calif.). "Motion-based calibration of an aerial device" was invented by Anh... Read More

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