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US Patent Issued to MURATA MANUFACTURING on Dec. 2 for "Antenna module and communication apparatus equipped with the same" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,225, issued on Dec. 2, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Antenna module and communication apparatus equipp... Read More


US Patent Issued to Yangtze Memory Technologies on Dec. 2 for "Electromagnetic interference shielding package structures and fabricating methods thereof" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,066, issued on Dec. 2, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Electromagnetic interference shielding package ... Read More


US Patent Issued to Intuit on Dec. 2 for "Resource utilization forecasting for predictive autoscaling" (California Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,716, issued on Dec. 2, was assigned to Intuit Inc. (Mountain View, Calif.). "Resource utilization forecasting for predictive autoscaling" wa... Read More


US Patent Issued to PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA on Dec. 2 for "Encoder, decoder, encoding method, and decoding method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,900, issued on Dec. 2, was assigned to PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA (Torrance, Calif.). "Encoder, decoder, encodin... Read More


US Patent Issued to Guangdong Guanyi Lighting on Dec. 2 for "Clamp" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. D1,103,729, issued on Dec. 2, was assigned to Guangdong Guanyi Lighting Co. LTD (Shaoguan, China). "Clamp" was invented by Shifang Wang (Dongguan, ... Read More


US Patent Issued to Infineon Technologies on Dec. 2 for "Method of manufacturing a semiconductor package, die, and die package" (German Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,017, issued on Dec. 2, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Method of manufacturing a semiconductor package, die,... Read More


US Patent Issued to LG ENERGY SOLUTION on Dec. 2 for "Button-type secondary battery" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,133, issued on Dec. 2, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Button-type secondary battery" was invented by Min Gyu... Read More


US Patent Issued to Shanghai Bilibili Technology on Dec. 2 for "Playback control" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,950, issued on Dec. 2, was assigned to Shanghai Bilibili Technology Co. Ltd. (Shanghai). "Playback control" was invented by Zhe He (Shanghai... Read More


US Patent Issued to Applied Materials on Dec. 2 for "In-situ etch rate and etch rate uniformity detection system" (California Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,022, issued on Dec. 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In-situ etch rate and etch rate uniformity detection s... Read More


US Patent Issued to The Trustees of the University of Pennsylvania on Dec. 2 for "'Smart' hydrogel for the radiosensitization and sustained delivery of therapeutics triggered by irradiation" (Pennsylvania, New York Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,401, issued on Dec. 2, was assigned to The Trustees of the University of Pennsylvania (Philadelphia). "'Smart' hydrogel for the radiosensiti... Read More