US Patent Issued to Infineon Technologies on Dec. 2 for "Method of manufacturing a semiconductor package, die, and die package" (German Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,017, issued on Dec. 2, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Method of manufacturing a semiconductor package, die, and die package" was invented by Fabian Craes (Soest, Germany), Wolfgang Lehnert (Lintach, Germany), Maik Lohmann (Soest, Germany) and Harry Walter Sax (Straubing, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor package is provided. The method may include singulating a wafer including a plurality of dies fixed to an auxiliary carrier to generate dies having released side surfaces, covering at least the side surfaces of the dies with a passivation layer using a dep...