US Patent Issued to Applied Materials on Dec. 2 for "In-situ etch rate and etch rate uniformity detection system" (California Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,022, issued on Dec. 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"In-situ etch rate and etch rate uniformity detection system" was invented by Keith Berding (San Jose, Calif.), Blake Erickson (Gilroy, Calif.), Soumendra Barman (San Jose, Calif.) and Zhaozhao Zhu (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An article, apparatus, and method for detecting an etch rate uniformity in a processing chamber of an electronics processing system is provided. A device is placed in a processing chamber of an electronics processing system. The device includes a first layer deposited on a surface of the device and a second l...