US Patent Issued to Yangtze Memory Technologies on Dec. 2 for "Electromagnetic interference shielding package structures and fabricating methods thereof" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,066, issued on Dec. 2, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China).

"Electromagnetic interference shielding package structures and fabricating methods thereof" was invented by Peng Chen (Hubei, China) and HouDe Zhou (Hubei, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor structure, comprising a die/die stack attached on a substrate, a conductive top block covering a top surface of the die/die stack, and a plurality of ground wires conductively connect the conductive top block and to the substrate. The conductive top block, the plurality of ground wires, and the substrate for...