ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,328, issued on Nov. 25, was assigned to Georgia Tech Research Corp. (Atlanta). "Devices, systems, and methods for processing optical compon... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,758, issued on Nov. 25, was assigned to MITSUBISHI HEAVY INDUSTRIES LTD. (Tokyo). "Substrate for power module and method of producing subst... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,258, issued on Nov. 25, was assigned to WUHAN UNIVERSITY (Wuhan, China). "Few-shot urban remote sensing image information extraction method... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,461, issued on Nov. 25, was assigned to MELLANOX TECHNOLOGIES LTD. (Yokneam, Israel). "Reducing retransmission latency" was invented by Lir... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,711, issued on Nov. 25, was assigned to eBay Inc. (San Jose, Calif.). "Systems, apparatuses, and methods for providing a quality score base... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,212, issued on Nov. 25, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas). "Identifying state of cartridge from the result... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,857, issued on Nov. 25, was assigned to ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY (Scottsdale, Ariz.). "Methods and re... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,660, issued on Nov. 25, was assigned to Spider Grills LLC (Athens, Ga.). "System and method for forced air control in a kamado-style cooker... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,105, issued on Nov. 25, was assigned to Daan Gene Co. Ltd. (Guangdong, China). "High temperature resistant reverse transcriptase mutants an... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,735, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package including a s... Read More