ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,220,682, issued on Feb. 11, was assigned to KURARAY Co. LTD. (Kurashiki, Japan). "Composite aggregate particles, adsorbent using same, molded b... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,222,579, issued on Feb. 11, was assigned to TDK TAIWAN CORP. (Taoyuan, Taiwan). "Optical element driving system" was invented by Ya-Hsiu Wu (Ta... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,220,430, issued on Feb. 11, was assigned to Imam Abdulrahman Bin Faisal University (Dammam, Saudi Arabia). "Method for killing colorectal cance... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,805, issued on Feb. 11, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Optical emission apparatus, optical communication... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,220,801, issued on Feb. 11, was assigned to Hilti AG (Schaan, Liechtenstein). "Impact mechanism arrangement" was invented by Uto Plank (Freisin... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,222,213, issued on Feb. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Digital twin based binaural audio echolocati... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,225,421, issued on Feb. 11, was assigned to ZTE Corp. (Shenzhen, China). "Method of a serving cell measurement object configuration" was invent... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. D1,061,377, issued on Feb. 11, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Wheel for an automobile... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,223,373, issued on Feb. 11, was assigned to REALTEK SEMICONDUCTOR Corp. (Hsinchu, Taiwan). "Electronic device capable of accessing memory card"... Read More
ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,221,569, issued on Feb. 11, was assigned to MODU TECH Co. LTD. (Gyeonggi-do, South Korea). "Adhesive tape for semiconductor package manufacturi... Read More