US Patent Issued to MAKITA on Dec. 9 for "Cooler and warmer box" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. D1,104,641, issued on Dec. 9, was assigned to MAKITA Corp. (Anjo, Japan). "Cooler and warmer box" was invented by Wataru Suzuki (Anjo, Japan) and A... Read More

US Patent Issued to TRINAMIX on Dec. 9 for "Enhanced material detection by stereo beam profile analysis" (German Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,492,982, issued on Dec. 9, was assigned to TRINAMIX GMBH (Ludwigshafen am Rhein, Germany). "Enhanced material detection by stereo beam profile a... Read More

US Patent Issued to NVIDIA on Dec. 9 for "Accelerated parallel processing of 5G NR signal information" (California, Texas Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,865, issued on Dec. 9, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Accelerated parallel processing of 5G NR signal information" was... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Dec. 9 for "Flash memory for performing margin read test operation and margin read test system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,263, issued on Dec. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Flash memory for performing margin read test o... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 9 for "Semiconductor device including stacked via contact and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,423, issued on Dec. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device including st... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 9 for "Semiconductor packages and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,434, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor packages and method of ... Read More

US Patent Issued to Fmad Engineering (SNG) on Dec. 9 for "High speed data packet flow processing with offload" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,432, issued on Dec. 9, was assigned to Fmad Engineering (SNG) Pte Ltd. (Singapore). "High speed data packet flow processing with offload" wa... Read More

US Patent Issued to Amazon Technologies on Dec. 9 for "Decoding audio watermarks using time shifts" (Massachusetts Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,219, issued on Dec. 9, was assigned to Amazon Technologies Inc. (Seattle). "Decoding audio watermarks using time shifts" was invented by Chr... Read More

US Patent Issued to Near-Miss Management on Dec. 9 for "Dynamic prediction of risk levels for manufacturing operations through leading risk indicators: dynamic risk pattern match method and system" (Pennsylvania Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,274, issued on Dec. 9, was assigned to Near-Miss Management LLC (Philadelphia). "Dynamic prediction of risk levels for manufacturing operati... Read More

US Patent Issued to KYOCERA on Dec. 9 for "Optical integrated circuit" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,204, issued on Dec. 9, was assigned to KYOCERA Corp. (Kyoto, Japan). "Optical integrated circuit" was invented by Reona Motoji (Tokyo), Tomo... Read More

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