US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 9 for "Semiconductor packages and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,434, issued on Dec. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and method of manufacturing the same" was invented by Hao-Cheng Hou (Hsinchu, Taiwan), Chien-Hsun Lee (Hsin-chu County, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan), Hung-Jen Lin (Tainan, Taiwan), Jung-Wei Cheng (Hsinchu, Taiwan) and Tsung-Ding Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first integrated circuit, a first conductive via, a second conductive via, a second integrated circuit, a third conductive via and an encapsulant. The first conductive via is disposed in a...