US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 9 for "Semiconductor device including stacked via contact and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,423, issued on Dec. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including stacked via contact and method for manufacturing the same" was invented by Chia-Hung Chu (Hsinchu, Taiwan), Po-Chin Chang (Hsinchu, Taiwan), Tzu-Pei Chen (Hsinchu, Taiwan), Yuting Cheng (Hsinchu, Taiwan), Kan-Ju Lin (Hsinchu, Taiwan), Chih-Shiun Chou (Hsinchu, Taiwan), Hung-Yi Huang (Hsinchu, Taiwan), Pinyen Lin (Hsinchu, Taiwan), Sung-Li Wang (Hsinchu, Taiwan), Sheng-Tsung Wang (Hsinchu, Taiwan), Lin-Yu Huang (Hsinchu, Taiwan), Shao-An Wang (Hsinchu, Taiwan) and Harry Chien (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Pate...