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ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. secures contract for Procurement of 0720-2540zbzx0095/06 ADDITIVE(2)

China, Sept. 12 -- China based ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. has secured contract from Petrochina Lubricant Company for Procurement of 0720-2540zbzx0095/06 ADDITIVE(2). The value of the contra... Read More


ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. secures contract for Procurement of 0720-2540zbzx0095/07 ADDITIVE(2)

China, Sept. 12 -- China based ROCK CHEMICAL TRADE(SHENZHEN)CO.,LTD. has secured contract from Petrochina Lubricant Company for Procurement of 0720-2540zbzx0095/07 ADDITIVE(2). The value of the contra... Read More


Besi Singapore Pte. Ltd. secures contract for Procurement of 0613-254022124127 Flip Chip BonderEquipmen(2)

China, Sept. 12 -- China based Besi Singapore Pte. Ltd. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124127 Flip Chip BonderEquipmen(2). The value of the contra... Read More


SEMIGEAR, INC. secures contract for Procurement of 0613-254022124125 Wafer Level Reflow Equipment(2)

China, Sept. 12 -- China based SEMIGEAR, INC. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124125 Wafer Level Reflow Equipment(2). The value of the contract is ... Read More


BEIJNG CAPCON LIMITED secures contract for Procurement of 0613-254022124124 Wafer Level Flip Chip Bonder Equipment(2)

China, Sept. 12 -- China based BEIJNG CAPCON LIMITED has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124124 Wafer Level Flip Chip Bonder Equipment(2). The value of... Read More


Suzhou Diruo Xing Technology Co., Ltd. secures contract for Procurement of 0613-254022124126 Wafer Level FC & Reflow connector Equipment(2)

China, Sept. 12 -- China based Suzhou Diruo Xing Technology Co., Ltd. has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124126 Wafer Level FC & Reflow connector ... Read More


BEIJNG CAPCON LIMITED secures contract for Procurement of 0613-254022124123 Wafer Level Flip Chip Bonder Equipment(without IPD function)(2)

China, Sept. 12 -- China based BEIJNG CAPCON LIMITED has secured contract from Yibu Semiconductor Co., Ltd. for Procurement of 0613-254022124123 Wafer Level Flip Chip Bonder Equipment(without IPD func... Read More


AtkinsRealis secures contract for Consultancy to Design Cost a Sustainable Travel Package/Business Justification Case 2025 - AWARD

United Kingdom, Sept. 12 -- United Kingdom based AtkinsRealis has secured contract from Dudley Metropolitan Borough Council for Consultancy to Design Cost a Sustainable Travel Package/Business Justifi... Read More


CarByte GmbH secures contract for Software-Related Services-Frontend Redesign VerkehrnRW

Germany, Sept. 12 -- Germany based CarByte GmbH has secured contract from NRW.Mobidrom GmbH for Software-Related Services-Frontend Redesign VerkehrnRW. The value of the contract is not disclosed. Pub... Read More


Eiffage Intra-Rail GmbH secures contract for Track Construction Works-3 Baustufe North-Sud Stadtbahn: Delivery and installation of track straps for the Bonner Str/Gurtel junction

Germany, Sept. 12 -- Germany based Eiffage Intra-Rail GmbH has secured contract from Vergabekammer Rheinland bei der Bezirksregierung Koln for Track Construction Works-3 Baustufe North-Sud Stadtbahn: ... Read More