Exclusive

Publication

Byline

Location

Programmable logic redefined for simpler, smarter, fully integrated designs

India, April 22 -- Engineers designing timing‑critical systems for motor control, industrial automation and automotive safety applications often face challenges with latency and unpredictable so... Read More


Synopsys solutions support NASA's Artemis program with spacesuit analysis and communication system development

India, April 22 -- NASA selected Synopsys Inc. and EMA to verify spacesuit compatibility with the lunar environment. This work advances Synopsys' ongoing support of future Artemis missions, which also... Read More


Groundbreaking of India's first advanced 3D semiconductor packaging unit in Odisha

India, April 21 -- In a defining moment for India's semiconductor ambitions and Odisha's emergence as a future-ready technology destination, the foundation stone for the country's first advanced 3D ch... Read More


Xebia powers scalable enterprise AI with NVIDIA, and Anthropic

India, April 21 -- Xebia, a global AI-first, digital transformation, and engineering partner, announced strategic partnerships with NVIDIA, and Anthropic reinforcing its commitment to advancing enterp... Read More


Cadence and Google to scale AI-driven chip design with ChipStack AI super-agent on Google Cloud

India, April 21 -- Cadence, an industry leader in AI-driven computational software for semiconductor and system design, has announced a strategic collaboration with Google to optimize the Cadence Chip... Read More


Co-packaged optics: Powering the next wave of AI infrastructures

India, April 20 -- Artificial intelligence (AI) is driving unprecedented growth in computing power and data movement. However, memory and interconnect bandwidth are struggling to keep pace, creating m... Read More


Terra One and INTILION implementing 30MWh battery storage system in Tangerhutte

India, April 20 -- Terra One has partnered with INTILION GmbH to realize a 15 MW / 30 MWh battery storage project in Tangerhutte, Saxony-Anhalt. Following the granting of the building permit and the ... Read More


IESA hails 3DGS groundbreaking as India's big leap in advanced semiconductor packaging

India, April 20 -- India Electronics and Semiconductor Association (IESA) has hailed the 3DGS groundbreaking as India's big leap in advanced semiconductor packaging. Ashok Chandak, President, IESA, a... Read More


Lightmatter announces reference architecture initiative with industry leaders in Open Compute Project for co-packaged optics

India, April 17 -- Lightmatter has announced a new collaborative initiative within the Open Compute Project (OCP) to create open specifications for a shared reference architecture enabling interoperab... Read More


Microchip expands dsPIC33A DSC family for high-density AI DC power, complex motor control, and intelligent sensing

India, April 17 -- As AI servers, data centers, automotive and industrial systems demand higher efficiency designs, deterministic real-time control and quantum-resistant cryptography, Microchip Techno... Read More