Japan, Oct. 30 -- HONDA MOTOR CO LTD has got intellectual property rights for 'TEMPERATURE CONTROL SYSTEM FOR VEHICLE AND VEHICLE.' Other related details are as follows: Application Number: JP,2023-1... Read More
Japan, Oct. 30 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2025-008562 Category (... Read More
Japan, Oct. 30 -- ISHII IRON WORKS CO LTD has got intellectual property rights for 'LIQUID LIFTING DEVICE FOR LOW-TEMPERATURE TANK.' Other related details are as follows: Application Number: JP,2023-... Read More
Japan, Oct. 30 -- COPCOM CO LTD has got intellectual property rights for 'PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE.' Other related details are as follows: Application... Read More
Japan, Oct. 30 -- PARAMOUNT BED CO LTD has got intellectual property rights for 'MULTI-FUNCTIONAL MATTRESS.' Other related details are as follows: Application Number: JP,2025-008429 Category (FI): A... Read More
Japan, Oct. 30 -- HONDA MOTOR CO LTD has got intellectual property rights for 'TEMPERATURE DETECTOR AND MANUFACTURING METHOD OF TEMPERATURE DETECTOR.' Other related details are as follows: Applicatio... Read More
Japan, Oct. 30 -- XITEC INC has got intellectual property rights for 'WAFER VACUUM CARRIER.' Other related details are as follows: Application Number: JP,2024-159971 Category (FI): H01L21/68@B,B65G4... Read More
Japan, Oct. 30 -- YAZAKI CORP has got intellectual property rights for 'CONDUCTOR MEMBER COOLING STRUCTURE.' Other related details are as follows: Application Number: JP,2023-152097 Category (FI): H... Read More
Japan, Oct. 30 -- TOSHIBA CORP has got intellectual property rights for 'WAVE FORM SIGNAL PROCESSING SYSTEM, STRUCTURE EVALUATION SYSTEM AND WAVE FORM SIGNAL PROCESSING METHOD.' Other related details ... Read More
Japan, Oct. 30 -- TOSHIBA CORP has got intellectual property rights for 'DIAGNOSIS DEVICE, DIAGNOSIS METHOD, AND DIAGNOSIS PROGRAM.' Other related details are as follows: Application Number: JP,2023-... Read More