ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,635, issued on Nov. 4, was assigned to ecoATM LLC (San Diego). "Identifying electronic devices using temporally changing information" was in... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,433, issued on Nov. 4, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan). "Imaging apparatus" was invented ... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,458,411, issued on Nov. 4, was assigned to AUGMEDICS LTD. (Yokneam, Israel). "Spinous process clamp" was invented by Nissan Elimelech (Beerotaim... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,722, issued on Nov. 4, was assigned to Kioxia Corp. (Tokyo). "Three-dimensional type NAND memory device" was invented by Tatsufumi Hamada (N... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,638, issued on Nov. 4, was assigned to Lockheed Martin Corp. (Bethesda, Md.). "Pitch drop friction brake" was invented by Tyler Christian Ka... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,458,978, issued on Nov. 4. "Homogenizer with an enhancing homogenizing property" was invented by In Soo Choi (Seongnam-si, South Korea). Accord... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,514, issued on Nov. 4, was assigned to Chevron U.S.A. Inc. (San Ramon, Calif.). "Systems and methods for evaluating securing systems for flo... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,458,982, issued on Nov. 4, was assigned to Georgia Tech Research Corp. (Atlanta). "Devices, systems, and methods of use thereof for magnetic sep... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,154, issued on Nov. 4, was assigned to SCHREIBER GMBH (Fulda, Germany). "Boron-free impregnating solution for a wick and boron-free wick" wa... Read More
ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,099, issued on Nov. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package including test ... Read More