ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,042, issued on July 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method for updating 3-dimensional map using ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,578, issued on July 29, was assigned to EBARA Corp. (Tokyo). "Substrate cleaning apparatus and substrate cleaning method" was invented by F... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,369,763, issued on July 29, was assigned to Robert Bosch GmbH (Stuttgart, Germany). "Method for controlling a suction device" was invented by M... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,482, issued on July 29, was assigned to Dongguan Hongxiang Electronic Technology Co. Ltd. (Dongguan, China). "Massager" was invented by Qin... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,752, issued on July 29, was assigned to CANON K.K. (Tokyo). "Optical system and image pickup apparatus having the same" was invented by Shi... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,299, issued on July 29, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display device and method of driving the same... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,148, issued on July 29, was assigned to DIGITAL MEDICAL RECORDS LLC (Philadelphia). "Methods and system of electronic image analysis" was i... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,086,572, issued on July 29. "Container for cosmetic stick" was invented by Jung Mo Jung (Seoul, South Korea), Jin Sung Lee (Seoul, South Korea)... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,318, issued on July 29, was assigned to OA DEFENSE LLC (Dayton, Nev.). "Trigger shoe assembly" was invented by Joseph Smathers (Dayton, Nev... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,561, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Chip package structure with rin... Read More