ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,194, issued on Jan. 27, was assigned to Think Surgical Inc. (Fremont, Calif.). "Light guided digitization method to register a bone" was in... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,317, issued on Jan. 27, was assigned to NXP B.V. (Eindhoven, Netherlands). "Dual polarized antenna with dual feed and cross polarization is... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,338, issued on Jan. 27, was assigned to Korea Electronics Technology Institute (Seongnam-si, South Korea). "Magnetic field sensing-based no... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,844, issued on Jan. 27, was assigned to NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS (Nanjing, China). "Nozzle-replaceable printing h... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,721, issued on Jan. 27, was assigned to BGI SHENZHEN (Guangdong, China). "Sequencing chip and manufacturing method therefor" was invented b... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,593, issued on Jan. 27, was assigned to Sony Interactive Entertainment Inc. (Tokyo). "Information processing device and report creation sup... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,943, issued on Jan. 27, was assigned to MUI LAB INC. (Kyoto, Japan). "Display panel and operation display panel" was invented by Munehiko S... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,532,963, issued on Jan. 27. "Detachable and combinable cabinet and its assembly method" was invented by Limin Yuan (Zhejiang, China). Accordin... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,685, issued on Jan. 27, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei, Taiwan). "Image feature matching method, computer ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,803, issued on Jan. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including a barrier st... Read More