India, Sept. 1 -- Taiwan Semiconductor's (TSMC) (TSM) N2 node is the most consequential process transition in its history. By the second half of this year, N2 will begin mass production for Apple, AMD, and Intel, with Nvidia, Qualcomm, and MediaTek following closely behind.

Demand already exceeds the initial 40,000 wafer-per-month ramp capacity for late 2025, leading to an expansion plan of 100,000 wafers per month in 2026, and up to 200,000 wafers per month by 2027. This node will surpass every previous generation in both scale and revenue potential.

The company's technology advances, particularly nanosheet gate-all-around transistors combined with backside power delivery, reset the power-performance curve for the first time since FinF...