India, Feb. 2 -- TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a 2nm process for the A20-series chip used in the iPhone 18, Apple is set to upgrade packaging technology from the current InFO (Integrated Fan-Out) process to WMCM (Wafer-Level Multi-Chip Module) packaging.

Sources cited by the report indicate that, compared with InFO, WMCM's defining advantage lies in its ability to integrate multiple chips with different functions in parallel on the redistribution layer (RDL), including the application processor, memory, and even high-speed I/O dies, driving higher interconnect density, improved packaging yield, and more advanced thermal management.

The report no...