India, April 4 -- IBM and Tokyo Electron Ltd have (TEL) announced an extension of their agreement for the joint R&D of advanced semiconductor technologies. The new five-year agreement will focus on the continued advancement of technology for next-generation semiconductor nodes and architectures to power the age of generative AI.

This agreement builds on a more than two-decade partnership between IBM and TEL for joint research and development. Previously, the two companies have achieved several breakthroughs, including the development of a new laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology.

Now, bringing together IBM's expertise in semiconductor process integration and TEL's leading-edge ...