India, Sept. 25 -- The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036.

As semiconductor packaging surges toward 2.5D and 3D architectures, managing thermal resistance at the interface becomes mission critical. With localized power densities surpassing 600 W/cm² for advanced semiconductors, traditional thermal interface materials no longer suffice.

Enter the next generation of Thermal Interface Materials (TIMs), and the opportunity to gain a quantum leap in thermal effici...