India, June 11 -- Thin Film Interconnect (TFI), based in Frederick, Maryland, announced a strategic technology partnership with Heisler Semiconductor LLC, headquartered in Baltimore, Maryland. This collaboration combines the technical strengths of two Maryland-based innovators to deliver a complete, end-to-end solution for wafer production, Through-Silicon Via (TSV) deposition, and full turn-key heterogeneous packaging.

Key benefits of the partnership include:

End-to-end semiconductor solutions: TFI and Heisler Semiconductor will provide a fully integrated process from wafer production through TSV formation and final packaging, offering customers a true one-stop shop for next-generation semiconductor devices.

Advanced technology develo...