India, Feb. 27 -- TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.

The system detects not only pattern defects and foreign particles but also cracks and other defects specific to glass substrates, and is compatible with glass core interposers and rewiring glass carriers, which are used in panel level packaging (PLP) and other applications.

Semiconductor manufacturers have previously introduced inspection systems for detecting surface defects on glass substrates, but this is the industry's first system capable of inspecting both the front and bac...