India, April 22 -- E&R Engineering Corp. (E&R), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, specializing in laser and plasma solutions.

Its laser technologies include marking, scribing, grooving, and wafer ID/backside marking, while its vacuum plasma solutions enable surface cleaning, oxide removal, and pre-bonding/pre-underfill/ pre-molding treatment to enhance package reliability and yield.

Taiwan-made excellence with OSAT-grade precision

E&R ensures top-tier quality through MIT (Made in Taiwan) manufacturing, integrating key components from leading European and US suppliers. All machines are manufactured, assemb...