India, Sept. 25 -- Synopsys Inc. announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design.

The 3DIC Compiler exploration-to-signoff platform and IP, tuned for 3D packaging, along with the company's partnership with TSMC on design enablement has resulted in multiple customer tape-outs.

Building on Synopsys' continued collaboration with TSMC is the availability of certified digital and analog flows, along with the enabled Synopsys.ai™ on TSMC's N2P and A16 processes using TSMC NanoFlex architecture.

In addition, Synopsys provides robust automo...