India, June 20 -- Synopsys Inc. announced its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications.

The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys' 3DIC Compiler and Samsung's advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (PPA) with certified EDA flows for SF2P process, and minimize IP integration risk with the high-quality portfolio of IP on Samsung's most advanced process technologies.

"The adoption of Edge AI applications is driving the need for advancements in semiconductor technologies to enab...