India, Aug. 28 -- SK hynix announced that it has developed a 321-layer 2Tb QLC NAND flash and has already begun mass production. This is the world's first QLC device to exceed 300 layers, setting a new milestone in NAND density. The product is scheduled for release in the first half of 2026, following completion of global customer validation.

The 321-layer QLC NAND delivers higher capacity and improved performance compared with earlier QLC products. The new 2Tb device provides twice the capacity of existing solutions.

To address potential performance challenges in high-capacity NAND, the company increased the number of planes-independent operating units within a chip-from four to six. This change enables greater parallel processing and ...