India, June 26 -- Siemens Digital Industries Software introduced two new solutions to its electronic design automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges associated with the design and manufacture of 2.5D and 3D Integrated Circuit (IC) designs.

Siemens' new Innovator3D IC solution suite enables IC designers to efficiently author, simulate and manage heterogeneously integrated 2.5D/3D IC designs. In addition, Siemens' new Calibre 3DStress software leverages advanced thermo-mechanical analysis to identify the electrical impact of stress at the transistor level. Together, these solutions dramatically reduce risk and enhance the design, yield and reliability of complex, next g...