India, April 25 -- Siemens Digital Industries Software has deepened long-standing collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

Building on a series of recent collaborations, Siemens has achieved certification for its Calibre nmPlatform software suite - including nmDRC, nmLVS, YieldEnhancer and PERC tools -- alongside its Analog FastSPICE (AFS) and Solido solutions, for TSMC's cutting edge N2P and A16 processes. Additionally, its Calibre 3DSTACK solution is certified for TSMC's 3DFabric technologies, and the 3Dblox standard, advancing silicon stacking and packaging design.

Siemens and TSMC are further advancing too...