India, Sept. 25 -- At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry's newest and most advanced process technologies.

Mutual customers can now leverage these advancements, which include substantial innovations in artificial intelligence (AI), 3D IC design, and advanced packaging, to develop compelling and highly differentiated new products.

"Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation," said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. "By ...