India, Sept. 26 -- Siemens Digital Industries Software is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack platform, using Siemens' Innovator3D IC solution, which is fully certified for the 3Dblox standard.

Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.

ASE's VIPack is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. As AS...