India, Oct. 10 -- Semiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe Munchen in Munich, to explore the latest trends and innovations in advanced packaging and fab management.

The Advanced Packaging Conference (APC), Fab Management Forum (FMF) and MEMS and Imaging Sensors Summit (MEMS) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with productronica, SEMICON Europa is the region's premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC, FMF, and MEMS.

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