India, Nov. 28 -- TrendForce's latest research points out that AI server design is undergoing a fundamental structural shift. From NVIDIA's Rubin platform featuring a fully cableless architecture, to hyperscalers' in-house ASIC servers adopting ultra-high-layer HDI designs, PCBs are no longer merely passive circuit carriers-they are becoming a core enabler of compute performance. The PCB industry is officially entering an era defined by high frequency, high power, and high density.
Rubin-generation servers mark a shift with their cableless interconnect design. Unlike in the past, when high-speed connections between GPUs and switches relied on cables, they are now routed directly through multilayer PCBs such as switch trays, midplanes, an...
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