India, Nov. 20 -- Qnity, DuPont's Electronics business, a premier technology solutions leader across the semiconductor value chain, announced the signing of a Memorandum of Understanding (MOU) with SK hynix, establishing a strategic long-term agreement for supply of polishing pads for chemical mechanical planarization (CMP) in semiconductor fabrication.

The agreement supports SK hynix's ongoing needs for advanced CMP pads, used for their next-generation semiconductor manufacturing and mass production processes. It reflects the continuation of a longstanding collaboration in enabling CMP materials for SK hynix's growing memory business.

"This agreement reflects our shared commitment to enabling advancements in the semiconductor and elect...