India, Nov. 18 -- As radio frequency front‑ends extend into Ka‑band (about 26.5-40 GHz) and data‑center networks advance toward co‑packaged optics, engineered low‑loss glass substrates valued for high resistivity, dimensional stability, and compatibility with through‑glass‑via interconnects are emerging as an integration platform for antenna‑in‑package modules and optical‑electrical co‑design alike, as discussed in IDTechEx's brand‑new report "Glass in Semiconductors 2026-2036: Applications, Emerging Technologies, and Market Insights".

Beyond compute: Why RF and optics pull on glass?

As networks scale for artificial intelligence (AI) clusters and bandwidth‑hun...