India, Dec. 9 -- HBM4 isn't even in mass production yet, but the industry is already sketching out HBM9!

According to The Elec, Yang Jun-mo, a principal researcher at the Korea Nanofab Center (NNFC), predicts that HBM9-expected to debut around 2040-will deliver performance more than 60 times higher than sixth-generation HBM4. The next-generation memory is projected to feature over 32 stacked layers and could reach bandwidths of up to 128 terabytes per second (TB/s).

The report, citing Yang, notes that for HBM9, its data rate could reach 36 Gbps, while the number of I/O channels is projected to rise to 32,768-four times and 16 times higher than HBM4, respectively. Memory capacity is also set to grow substantially, increasing from 24GB in...